Fluid Flow analysis
Splitter and Combiner Adaptors Flow Balance & Pressure Drop Optimisation. Use of CFD to design connector adaptors to achieve low pressure drop as well as balance/equate the fluid flow in eight parallel lines feeds.
Combined fluid flow and thermal (thermo-fluids) analysis and design
An electronics enclosure with a large TFT LCD monitor used to display advertisements in a public place was experiencing intermittent operational failures. A thermofluids study and simulation of the upper end of the environmental operating conditions showed that the design was susceptable to occassional failure. The route cause was identified and the internal airflow field was redesigned to ensure adequate cooling was provided to the critical components. Micro-processor technology upgrade was also recommended to reduce overall thermal dissipation within the enclosure.
Electronics cooling and thermal management
To improve pack level thermal analysis results accuracy, a "zoom-in" detailed analysis of the critical component was carried out. Flow and thermal boundary conditions of the PowerPC of the detailed model were determined from the pack/sub-system level CFD solution. The solution derived from CFD thermal analysis resulted in improved operating temperature predictions. The final CFD results obtained were within 5% of experimentally measured results.
Cool Design Optimisation of a Shower Pump
- Old Design Velocity Field - Inefficient airflow.
- New CFD optimised Design Velocity Field - Very efficient airflow.
Telecommunication products thermal management development
Pack Level Thermal Analysis
The 1U telecommunications multi-PCB Pack shown below was developed using CFD analysis and design. The objective was to ensure adequate cooling of all components under all operating conditions, including at 3000m altitude with 50°C ambient air temperature. The product was for deployment in ETSI and UL territories.
Consumer electronics cooling design
Pentium IV cPCI hermal ANalysis
Project objective was to design and develop a thermal solution for Pentium IV cPCI card, in particular the complimentary IC chips mounted downstream of CPU. The problem was identified as PCB layout configuration, component placement, as well as airflow wake created by Pentium IV heat sink. A solution was derived from the CFD analysis and simulation studies. The final results recommended were verified experimentally and showed good agreement with the CFD predictions.
Structural analysis and dynamic analysis FEA modal analysis and drop-test simulation
FEA modal analysis enabled design concepts to be compared and evaluated at early design stages, eliminating risks and saving on the number of verification prototypes.
1st Mode results of concept 1 and 1st Mode results of concept 2.
1.5m Drop Test Simulation of an Oil-Well Data Logger
Non-Linear - Large deflections & Contact FEA Simulation
