Consumer electronics cooling design
Pentium IV cPCI thermal analysis
Project objective was to design and develop a thermal solution for Pentium IV cPCI card, in particular the complimentary IC chips mounted downstream of CPU. The problem was identified as PCB layout configuration, component placement, as well as airflow wake created by Pentium IV heat sink. A solution was derived from the CFD analysis and simulation studies. The final results recommended were verified experimentally and showed good agreement with the CFD predictions.