Telecom Cool

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Client: Test Client 2
Task:
Skills:
Telecommunication products thermal management development

Pack Level Thermal Analysis

The 1U telecommunications multi-PCB Pack shown below was developed using CFD analysis and design. The objective was to ensure adequate cooling of all components under all operating conditions, including at 3000m altitude with 50°C ambient air temperature. The product was for deployment in ETSI and UL territories.